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 BSS 110
SIPMOS (R) Small-Signal Transistor * P channel * Enhancement mode * Logic Level
* VGS(th) = -0.8...-2.0 V
Pin 1 S Type BSS 110 Type BSS 110 BSS 110 BSS 110 Pin 2 G Marking SS 110 Pin 3 D
VDS
-50 V
ID
-0.17 A
RDS(on)
10
Package TO-92
Ordering Code Q62702-S500 Q62702-S278 Q67000-S568
Tape and Reel Information E6288 E6296 E6325
Maximum Ratings Parameter Drain source voltage Drain-gate voltage Symbol Values -50 -50 Unit V
VDS V
DGR
RGS = 20 k
Gate source voltage Continuous drain current
VGS ID
20 A -0.17
TA = 35 C
DC drain current, pulsed
IDpuls
-0.68
TA = 25 C
Power dissipation
Ptot
0.63
W
TA = 25 C
Semiconductor Group
1
12/05/1997
BSS 110
Maximum Ratings Parameter Chip or operating temperature Storage temperature Thermal resistance, chip to ambient air 1) DIN humidity category, DIN 40 040 IEC climatic category, DIN IEC 68-1 Symbol Values -55 ... + 150 -55 ... + 150 200 E 55 / 150 / 56 K/W Unit C
Tj Tstg RthJA
Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Values typ. max. Unit
Static Characteristics Drain- source breakdown voltage
V(BR)DSS
-50 -1.5 -0.1 -2 -1 5.3 -2
V
VGS = 0 V, ID = -0.25 mA, Tj = 25 C
Gate threshold voltage
VGS(th)
-0.8
VGS=VDS, ID = -1 mA
Zero gate voltage drain current
IDSS
-1 -60 -0.1
A
VDS = -50 V, VGS = 0 V, Tj = 25 C VDS = -50 V, VGS = 0 V, Tj = 125 C VDS = -25 V, VGS = 0 V, Tj = 25 C
Gate-source leakage current
IGSS
-10
nA 10
VGS = -20 V, VDS = 0 V
Drain-Source on-state resistance
RDS(on)
VGS = -10 V, ID = -0.17 A
Semiconductor Group
2
12/05/1997
BSS 110
Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Dynamic Characteristics Transconductance Values typ. max. Unit
gfs
0.05 0.09 30 17 8 -
S pF 40 25 12 ns 7 10
VDS 2 * ID * RDS(on)max, ID = -0.17 A
Input capacitance
Ciss Coss
-
VGS = 0 V, VDS = -25 V, f = 1 MHz
Output capacitance
VGS = 0 V, VDS = -25 V, f = 1 MHz
Reverse transfer capacitance
Crss
-
VGS = 0 V, VDS = -25 V, f = 1 MHz
Turn-on delay time
td(on)
VDD = -30 V, VGS = -10 V, ID = -0.27 A RG = 50
Rise time
tr
12 18
VDD = -30 V, VGS = -10 V, ID = -0.27 A RG = 50
Turn-off delay time
td(off)
10 13
VDD = -30 V, VGS = -10 V, ID = -0.27 A RG = 50
Fall time
tf
20 27
VDD = -30 V, VGS = -10 V, ID = -0.27 A RG = 50
Semiconductor Group
3
12/05/1997
BSS 110
Electrical Characteristics, at Tj = 25C, unless otherwise specified Symbol Values Parameter min. Reverse Diode Inverse diode continuous forward current IS typ. max.
Unit
A -0.95 -0.17 -0.68 V -1.2
TA = 25 C
Inverse diode direct current,pulsed
ISM
-
TA = 25 C
Inverse diode forward voltage
VSD
VGS = 0 V, IF = -0.34 A
Semiconductor Group
4
12/05/1997
BSS 110
Power dissipation Ptot = (TA)
Drain current ID = (TA) parameter: VGS -10 V
-0.18 A
0.70 W 0.60
Ptot
0.55 0.50 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 0
ID
-0.14 -0.12 -0.10 -0.08 -0.06 -0.04 -0.02 0.00 0
20
40
60
80
100
120
C
160
20
40
60
80
100
120
C
160
TA
TA
Safe operating area ID=f(VDS) parameter : D = 0.01, TC=25C
Drain-source breakdown voltage V(BR)DSS = (Tj)
-60 V -58
V(BR)DSS-57
-56 -55 -54 -53 -52 -51 -50 -49 -48 -47 -46 -45 -60
-20
20
60
100
C
160
Tj
Semiconductor Group
5
12/05/1997
BSS 110
Typ. output characteristics ID = (VDS) parameter: tp = 80 s
-0.38 A -0.32
Typ. drain-source on-resistance RDS (on) = (ID) parameter: tp = 80 s, Tj = 25 C
32
Ptot = 1W
lj k
i
ha
VGS [V] -2.0
b c -2.5 -3.0 -3.5 -4.0 -4.5 -5.0 -6.0 -7.0 -8.0 -9.0 -10.0
a
b
c
d
e
f
ID
-0.28 -0.24 -0.20 -0.16 -0.12
e g
RDS (on)
24
d e f g h
20
16
fi
j k l
12
8 4 VGS [V] =
g i
a b c d e f -2.5 -2.0 -3.5 -4.0 -4.5 -5.0 -6.0 -3.0 g h i j -7.0 -8.0 -9.0 -10.0
-0.08
c
d
h j
-0.04 0.00 0.0
a b
-1.0
-2.0
-3.0
-4.0
-5.0
V
-6.5
0 0.00 -0.04 -0.08 -0.12 -0.16 -0.20 -0.24 -0.28 A -0.34
VDS
ID
Typ. transfer characteristics ID = f(VGS) parameter: tp = 80 s VDS 2 x ID x RDS(on)max
-0.9 A
Typ. forward transconductance gfs = f (ID) parameter: tp = 80 s, VDS2 x ID x RDS(on)max
0.16
S
ID
-0.7 -0.6
gfs
0.12
0.10 -0.5 0.08 -0.4 0.06 -0.3 -0.2 -0.1 0.0 0 -1 -2 -3 -4 -5 -6 -7 -8 V -10 0.04
0.02 0.00 0.0
-0.1
-0.2
-0.3
-0.4
-0.5
-0.6
VGS
A ID
-0.8
Semiconductor Group
6
12/05/1997
BSS 110
Drain-source on-resistance RDS (on) = (Tj) parameter: ID = -0.17 A, VGS = -10 V
24
Gate threshold voltage VGS (th) = (Tj) parameter: VGS = VDS, ID = -1 mA
-4.6 V -4.0
20
RDS (on)
18 16 14 12 10 8
VGS(th)
-3.6 -3.2 -2.8
98%
-2.4
98%
-2.0 -1.6
typ
typ
6 4 2 0 -60 -20 20 60 100 C 160 -1.2
2%
-0.8 -0.4 0.0 -60 -20 20 60 100 C 160
Tj
Tj
Typ. capacitances C = f (VDS) parameter:VGS=0V, f = 1 MHz
10 3
Forward characteristics of reverse diode IF = (VSD) parameter: Tj, tp = 80 s
-10 0
pF C 10 2
A
IF
-10 -1
Ciss Coss
10 1 -10 -2
Crss
Tj = 25 C typ Tj = 150 C typ Tj = 25 C (98%) Tj = 150 C (98%)
10 0 0
-5
-10
-15
-20
-25
-30
V VDS
-40
-10 -3 0.0
-0.4
-0.8
-1.2
-1.6
-2.0
-2.4
V
-3.0
VSD
Semiconductor Group
7
12/05/1997


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